MediaTek Dimensity 9200 Announced with Arm Cortex X3 & Immortalis G715 GPU

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Today, MediaTek announced the new flagship Dimensity 9200. The Dimensity 9200 is the first smartphone chip to integrate an ultra-core Arm Cortex X3 with operating speeds over 3GHz, and the first to feature the Arm Immortalis GPU with a hardware-based ray tracing engine.

During my pre-brief, perhaps one of the most important takeaways was that Mediatek expects that the Dimensity 9200 will feature on more phones that enter the western market. The current MediaTek Dimensity 9000 may be superior to the Qualcomm Snapdragon 8 Gen 1, but it is not much use when you can’t buy a phone using the chipset.

MediaTek Dimensity 9200 vs Dimensity 9100 Specification

Mediatek Dimensity 9200Dimensity 9100
Fabrication ProcessTSMC 4nm 2nd GenTSMC 4nm
CPU1 x Arm Cortex X3 @ 3.05 GHz
3 x Arm Cortex A715 @ 2.85GHz
4 x Arm Cortex A510 @ 1.8GHz
1 x Arm Cortex X2 @ 3.05 GHz
3 x Arm Cortex A710 @ 2.85GHz
4 x Arm Cortex A510 @ 1.8GHz
CPU Cache 8MB L3
6MB System Cache
8MB L3 cache
6MB system cache
GPUArm Immortalis G715
11x Cores
HW Ray Tracing GPU
Arm Mali-G710 GPU MC10
RAMLPDDR5X 8533Mbps
+13% bandwidth
LPDDR5X 7500Mbps
APUAPU 690APU 590
ISPImagiq 890
RGBW ISP
Imagiq 790
18-bit HDR-ISP fusion up to 9Gpixel/s
Up to 320MP Primary Camera
3-exposure HDR Videography
Display MiraVision 890 MiraVision 790
144Hz WQHD+ / 180Hz FullHD+
MediaTek Intelligent Display Sync 2.0
5G 8cc mmWave (2x faster vs non-mmW)
4cc sub-6GHz (25% faster vs 3cc)
7.9Gbps Peak Throughput
mmWave SMART Beaforming (+25%)
3GPP Release 16 5G modem
5G NR 3CC Carrier Aggregation (300MHz) up to 7Gbps
ConnectivityWiFi 7 ready
Bluetooth 5.3
Up to 13 navigation ssytems
Wi-Fi 6E 2x2 (BW160)
Bluetooth 5.3

MediaTek Dimensity 9200 Key Features

  • 2nd Generation TSMC 4nm process: 1x Arm Cortex-X3 at 3.05GHz, 3x Arm Cortex-A715 at 2.85GHz, and 4x Arm Cortex-A510 at 1.8GHz, optimized to improve power efficiency in combination with MediaTek’s innovative thermal package design that keeps smartphones cool.
  • Cutting-edge display technology: Supports Full HD+ up to 240Hz, WHQD up to 144Hz and 5K (2.5Kx2) up to 60Hz, with adaptive refresh rate technology for a smooth user experience.
  • AI visual semantic display: Optimizes picture quality with multi-person segmentation and multilayer color management per scene.
  • MediaTek AI-SR/MEMC: Provides best-in-class video streaming.
  • MediaTek Smart Blulight Defender: Ensures a more comfortable viewing experience.
  • Bluetooth LE Audio-ready technology: Brings best-in-class audio latency with Dual-Link True Wireless Stereo Audio for incredible sound quality.
  • LPDDR5X with support for up to 8533Mbps memory: Delivers the fastest smartphone memory.
  • UFS 4.0 with Multi-Circular Queue (MCQ): Provides each Cortex-A510 CPU core with direct access to storage, significantly boosting data transmission in multi-thread applications

Fabrication Process & Arm Cortex X3 CPU

The Dimensity 9200 remains on a  TSMC 4nm process, but this is now the 2nd generation, and MediaTek claims that it is 25% more power efficient and has a superior thermal package design that keeps smartphones cool.

This is then the first chipset to be announced with the Arm Cortex X3 CPU, which runs at 3.05 GHz.

It upgrades the Cortex A710 cores to Cortex A715 but keeps the frequency the same.

The little cores are the same as the previous generation.

Mediatek claims that these changes result in a 12% increase in single-core and a 10% increase in multi-core Geekbench results.

The new thermal package improves heat dissipation by 10%, which in turn delays the temperature rise time by four-fold. This should mean that phones equipped with this chipset will take much longer before they start to thermal throttle.

Thermal throttling is quite an important aspect of modern chipsets. The Qualcomm Snapdragon 8 Gen 1 had significant issues when using the Samsung fabrication process. The Google Tensor chipset was even worse for it. The shift from Samsung to TSMC had a significant impact on the performance of the Snapdragon 8+ Gen 1.

It looks like MediaTek may stay ahead of the game when it comes to thermal throttling when compared to its counterparts.

Arm Immortalis G715 GPU

Mediatek is also the first to use the Immortalis G715 GPU, and they will probably be the only company using it until Google release the Tensor G3.

This is now an 11-core GPU and the first mobile GPU to support hardware-based Ray Tracing.

Mediatek is claiming a 32% increase in GPU performance compared to the previous generation while being 41% more power efficient.

Benchmarks

Mediatek has hinted at benchmark results, and there have been some early leaks.

As well as the above Geekbench results, Mediatek has started than the Dimensity 9200 scores 1,260,000 in Antutu V9.

Antutu currently states that the Dimensity 9000 achieved 1,133,998 on the ROG Phone 6D Ultimate and 1,00,1534. For Qualcomm, they achieve 1,122,406 with the ROG Phone 6 Pro.

Ice Universe posted that the chipset was able to achieve 328fps on Manhattan 3.0 (1080p offscreen) and 228fps for Manhattan 3.0 (1080p offscreen). The Snapdragon 8 Gen 1 devices tend to get 187fps and 167fps, respectively.

6th Generation Flagship 690 APU

Artificial Intelligence is one of the main areas companies have been trying to improve performance in recent years. In particular, Google has put more focus on the AI performance of the Tensor chipsets than other aspects.

The chipset’s sixth-generation AI Processing Unit (APU 6.0) enhancements include up to 18% faster peak clock speeds and 30% power efficiency compared to the fifth-generation APU.

Imagiq 890 RGBW ISP

The Dimensity 9200 is the first chipset to have native support for RGBW sensors which then allows phones to avoid Bayer conversion, providing up to 34% more power savings than competing solutions.

Additionally, users can create better cinematic videos and enjoy superior AI motion unblur technology thanks to MediaTek’s fast, accurate AI-NR photo capture technology. For video captures, the Video Stream Engine fuses the chipset’s APU and ISP; this allows device makers to add unique AI video enhancements that are notably faster and more power efficient.

5G Connectivity and Wi-Fi 7

The Dimensity 9200 is the first Wi-Fi 7-ready smartphone platform, supporting up to 6.5 Gbps data rates. At the time of writing, there are no Wi-Fi 7 routers, and it is likely OEMs will need to choose to integrate the Wi-Fi 7 functionality, so we may not see this next-generation networking standard for a while yet.

When it does launch, it should allow phones to use 320 MHz channel width of the 6Ghz band for connection speeds of 4800Mbps. It then also has multi-band/multi-channel aggregation allowing it to connect to multiple bands at once for increased throughput.

As for 5G connectivity, the chipset integrates an advanced, built-in 5G modem with AI for faster network searching, 5G connection recovery out of dead zones, and other intelligent connectivity enhancements. It also delivers seamless 5G experiences by fluidly switching between long-reach sub-6GHz and super-fast mmWave connections simultaneously.

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