It is currently expected that the MediaTek Dimensity 9000 will cost significantly more than this years flagship Dimensity 1200 due to the adopting cutting edge technologies that will put them in direct competition with the Qualcomm Snapdragon 8 Gen1.
Last week, MediaTek confirmed that there would be a new Dimensity 8000 chipset launched, which will be a lower-cost alternative to the MediaTek Dimensity 9000.
Some basic details of the Dimensity 8000 have been revealed. It appears that it will offer some incremental improvements over the excellent Dimensity 1200 while retaining the attractive pricing associated with MediaTek phones.
The new chip will use TSMC’s 5 nm process, which is an upgrade from the 6nm fabrication process the Dimensity 1200 used and put it on par with other flagship chipsets from 2021. However, it is not as advanced as the 4nm fabrication process the Dimensity 9000 will be using.
The Dimensity 8000 will stick to an older CPU design, using the ARMv8 ARM Cortex-A78 CPU running at 2.75 GHz and then the Cortex- A55 running at 2.0 GHz.
The MediaTek Dimensity 1200 has a single core running at 3 Ghz, but the other A78 cores all run at 2.6Ghz, and the A55 cores all run at the same 2.0 GHz.
The Dimensity 8000 should therefore offer better multi-core performance but perhaps not quite the same peak performance. The improved fabrication process should allow it to have improved sustained performance.
The Dimensity 9000 has gone all out with the specification and uses a new Cortex X2 and A710 for the big and middle cores then the A510 for the little cores.
The Dimensity 9000 will therefore be considerably more powerful than the 8000, but as we saw with chipsets this year, it is possible it may struggle with thermal throttling. It is hoped that the 4nm TSMC fabrication process will not have the same issues as the Samsung 5nm that Qualcomm and Samsung used this year.
The GPU in the Dimensity 8000 is the new mid-range Mali-G510 MC6. It is claimed that this should have a 100% performance boost, which is in comparison to the ARM Mali-G57 and will use the new 3rd generation Valhall architecture instead of Gen 1.
For reference, it was the Dimensity 800U that implemented the ARM Mali-G57 but only with 4-clusters and the Kirin 820 used the Mali-G57 MP6 design. The Kirin 820 achieved a 6327 score in 3DMark Sling Shot (ES 3.0) Unlimited Graphics and 55fps in GFXBench 3.0 Manhattan
The MediaTek Dimensity 1200 uses the Arm Mali G77 MC9. This achieved 11770 in 3DMark Sling Shot (ES 3.0) Unlimited Graphics and 106fps in GFXBench 3.0 Manhattan.
If the 100% improvement is accurate, it is, therefore, quite likely that the Dimensity 8000 should outperform the 1200.
The Dimensity 9000, again, uses one of the best specs available with ARM Mali-G710 MC10. Meditek recently showed some benchmarks with the new chip, with it managing 238 fps GFXBenc v3.0 Manhattan. Which is likely double the performance of the Dimensity 8000.
MediaTek Dimensity 9000 vs 8000 vs 1200 Specification Table
|MediaTek Dimensity 9000||MediaTek Dimensity 8000||Mediatek Dimensity 1200|
|Fabrication Process||4nm TSMC||5nm TSMC||6nm|
|CPU||1 x Arm Cortex-X2 @ 3.05 GHz|
3 x ArmCortex-A710 @ 2.85 GHz
4 x Arm Cortex-A510 @ 1.8 GHz
|4x ARM Cortex-A78 @ 2.75 GHz|
4x ARM Cortex-A55 @ 2.0 GHz
|1 x Arm Cortex A78 @ 3.0Ghz
3 x Arm Cortex A78 @ 2.6Ghz
4 x Arm Cortex A55 @ 2Ghz
|GPU||ARM Mali-G710 MC10||Mali-G510 MC6 GPU||Arm Mali G77 MC9|
|AI/NPU||5th Gen 4+2 core APU||TBC||APU 3.0|
The other small bits of information Mediatek revealed about the Dimensity 8000 are that it supports 168 Hz displays at 1080p+ resolution and 120 Hz at 1440p+ resolution. For memory, it can be hooked up to LPDDR5 and UFS 3.1.
The Dimensity 8000 chipset will be used on phones in 2022, and Realme has already confirmed interest in using the chipset.
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