These two chipsets have been rumoured to offer Qualcomm Snapdragon 888-like performance but at a lower price point.
MediaTek has also announced the Dimensity 1300. It is not very clear what the difference is between the Dimernsity 1200 as the full CPU frequencies are not mentioned in the press release. However, the new chipset gets the new MediaTek HyperEngine 5.0, up from version 3.0.
MediaTek HyperEngine boosts every aspect of smartphone gaming because every millisecond matters. In its 5th generation, gamers benefit from low-latency 5G and Wi-Fi connections with intelligent multi-network balancing, attuned resource management that boosts and sustains FPS while also maximizing battery life; and new AI-based imaging enhancements to make use of MediaTek’s powerful APU.
MediaTek Dimensity 8100 / 8000 vs Dimensity 9000 vs Dimensity 1200 / 1300 Specifications
|Dimensity 9000||Dimensity 8100/8000||Dimensity 1200 / 1300|
|Process||TSMC N4||TSMC N5||TSMC 6nm|
|CPU||1x Arm Cortex-X2 (3.05GHz)|
3x Arm Cortex-A710 + 4x Arm Cortex-A510
|4x Arm Cortex-A78 (2.85GHz/2.75GHz)|
4x Arm Cortex-A55 (2Ghz)
|1x Arm Cortex-A78 (3GHz)
3x Arm Cortex-A78 (2.6Ghz) + 4x Arm Cortex-A55 (2Ghz)
|GPU||Arm Mali-G710 MC10||Arm Mali-G610 MC6||Arm Mali-G77 MC9|
|AI||MediaTek APU 5.0|
4x Perf. Cores + 2x Eff. Cores
4x Perf. (vs. Dimensity 1200)
|MediaTek APU 5.0|
2x Perf. Cores + 1x Eff. Cores
2x Perf. (vs. Dimensity 1200)
|MediaTek APU 3.0|
|Camera||320MP camera support|
|200MP camera support|
|Modem||3GPP R16-ready 5G modem, Sub-6GHz|
|3GPP R16-ready 5G modem, Sub-6GHz|
|3GPP R16-ready 5G modem, Sub-6GHz
CPU & Fabrication Process
In comparison to the Dimensity 12000, MediaTek has dropped the single high-performance core with all four cores at the same frequency. Therefore the high-performance core is clocked lower, but the middle cores clockec higher. This should mean the single-core performance is reduced, but multi-core is improved.
Perhaps, more importantly, is the shift from the 6nm fabrication process to 5nm, which should make it more energy-efficient.
If we look at the Snapdragon 888, the MediaTek 8000 chips will have higher frequencies and a superior fabrication process.
The Arm Mali-G610 MC6 on the Dimensity 8100 / 8000 is the same microarchitecture as the G710 used on the 9000, just at lower core counts (6 vs 10).
While that gives some idea of how the Dimensity 8000 will compare to the Dimensity 9000, it is less clear when compared to the Dimensity 1200 with the Arm Mali-G77 MC9.
The Mali-G78 claimed to offer a 25% improvement to performance density compared to the G77 as well as a 10% improvement in energy efficiency. The shift from G78 to G710 claimed to have 20% improvement for gaming and 20% improvement in power savings.
Whatever that means in real-world performance remains unknown for now, but in theory, it should mean the Dimensity 8000 chipset have similar if not better performance than the 1200 while being considerably more energy efficient.
Like the other chipset maker, MediaTek has started to put significant emphasis on the AI performance.
The Dimensity 8000 chips claim to offer twice the performance of the Dimensity 1200, but half the performance of the Dimensity 9000.
I don’t find that the AI Benchmark is the most accurate of benchmarks, but it is easy to reference. Currently in V4, the MediaTek Dimensity 9000 sits at the top with a score of 1022k. So, in theory, the Dimensity 8000 should be around 500k.
Then you have the SD888 with an official score of around 550k with Google Tensor scoring lower with 333kl
In my benchmarks, using the latest version of AI Benchmark, I have:
- Google Tensor: 311.7k
- Qualcomm Snapdragon 8 Gen 1: 254.7k
I have been liking the direction MediaTek has been going in. Last year the Dimensity 1200 was a fantastic chipset offer a good balance of performance, efficiency and affordability.
This year, MediaTek could very well have the best flagship chipset on the market, but this will come with premium pricing comparable to flagship phones using the Qualcomm Snapdragon 8 Gen 1.
The Dimensity 8100 and 8000 should be ideal chipsets for upper-midrange phones, and I think these could very well be the best bang for your buck chipsets this year.
Full Press Release
MediaTek today launched the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) to bring flagship level technology – connectivity, displays, gaming, multimedia and imaging features – to premium 5G smartphones.
Both chips borrow the advanced technology from MediaTek’s powerful flagship Dimensity 9000 platform and package it into the new Dimensity 8000 series which is built on the ultra-efficient TSMC 5nm production process with an octa-core CPU.
The Dimensity 8100 integrates four premium Arm Cortex-A78 cores with speeds reaching 2.85GHz, and the Dimensity 8000 has four Cortex-A78 cores operating at up to 2.75GHz.
“You could say the MediaTek Dimensity 8000 series is the little brother to our flagship Dimensity 9000 chip. Meaning it brings flagship grade features and next level energy efficiency to the premium
smartphone market,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit.
Both chips combine an Arm Mali-G610 MC6 GPU with MediaTek’s HyperEngine 5.0 gaming technologies for exceptional power-efficiency that extends play time, and best-in-class frame rates – 170fps for the Dimensity 8100 and 140fps for the Dimensity 8000. Quad-channel LPDDR5 memory and UFS 3.1 storage ensure ultra-fast data streams.
The new Dimensity 8000 series also uses MediaTek’s Open Resource Architecture to give device makers the flexibility to customize and differentiate features so they can make 5G smartphones and 5G experiences that truly stand out.
The Dimensity 8000 series integrates MediaTek’s fifth generation AI processing unit, APU 580. It delivers the most power-efficient performance in its class. The balance of performance and efficiency optimizes AI multimedia, gaming, camera and video experiences.
Powered by a five gigapixel per second image signal processor (ISP), the Dimensity 8000 series produces the fastest, clearest HDR photos and video in its class.
“MediaTek’s big bet on 5G dramatically expanded its global smartphone SoC volumes in the mid-tier, and the Dimensity 9000 is opening up the flagship market,” said Avi Greengart, President of market advisory firm Techsponential. “With the Dimensity 8000, MediaTek is giving smartphone vendors more options to balance performance and pricing while still offering flagship level gaming and AI capabilities.”
The features of the Dimensity 8000 series chips also include:
- Support for up to 200MP cameras and 4K60 HDR10+ videography.
- MediaTek’s latest noise reduction and AI-based unblur techniques in extreme low-light environments for crisp shots with enhanced details.
- Simultaneous dual camera HDR video recording. Users can record with the front and rear cameras or two different rear lenses – for example, wide + tele – at the same time.
- Leading 3GPP R16-ready 5G modem to boost sub-6GHz performance using 2CC Carrier Aggregation.
- MediaTek’s 5G UltraSave 2.0 power-saving enhancement suite for improved efficiency.
- Support for Wi-Fi 6E and Bluetooth 5.3 for seamless coexistence of Wi-Fi connectivity and Bluetooth peripherals.
MediaTek also added the 6nm Dimensity 1300 to its 5G family. The Dimensity 1300’s HDR-ISP supports up to 200MP, and integrates MediaTek’s HyperEngine 5.0 to offer an optimal balance between performance and power for better efficiency in gaming and daily use scenarios. It comes with new AI enhancements, improving night shot photography and HDR capabilities for great image clarity.
The Dimensity 1300 integrates an octa-core CPU with an ultra-core Arm Cortex-A78 clocked up to 3GHz, three Arm Cortex-A78 super cores and four Arm Cortex-A55 efficiency cores, along with an Arm Mali- G77 GPU and MediaTek APU 3.0 to support the latest AI capabilities.
Smartphones powered by the Dimensity 8100, Dimensity 8000 and Dimensity 1300 will be available in the market starting from the first quarter of 2022, powering a new era of incredible 5G devices by some of the world’s biggest smartphone brands.